Circuit Boards
Printed Circuits Boards
Production specification
| Descriptions | Capacity |
| Material | FR4, FR2, Cem, High TG, Aluminium, Flex |
| Layers count | 1-16 layers |
| Finish board thickness | 0.15 mm up to 3.5 mm |
| Max Panel size | 20"x24" (508x609 mm) |
| Min. Trace width/spacing | Outer layers: 4/4 mil (0.1/0.1 mm) Inner layers: 4/4 mil (0.1/0.1 mm) |
| Misregistraction | ≤0.125 mm |
| Copper foil thickness | 1/2 oz to 4 oz |
| Min. Drilling size | 0.2 mm |
| Tolerance of PTH | ±0.08 mm |
| Tolerance of NPTH | ±0.05 mm |
| Tolerance of hole position | ±0.076 First Drill ±0.127 mm Second Drill |
| Copper thickness in PTH (Normal) | 18um Min (According to IPC-A-600F Class II) |
| Finished board thickness tolerance | ≤0.8±0.0762 mm ≥1.0 mm±10% |
| Impedance control | ±10% |
| Routing outline tolerance | ±0.13 mm |
| Punching outline tolerance | ±0.1 mm |
| Flatness (Bow and twist) | ≤0.75% (According to IPC-A-600F Class II) |
| Surface Finish | OSP, HAL, Leadfree HAL, Flash gold, Chemical gold, Chemical Tin, Chemical Silver, Gold finger |
| Additional finish | Peelable Mask, Carbon Ink |
| ENIG Thickness (Normal) | Au: 3u" (0.025-0.075um); Ni: 120-200u" (3-5um) |
| Immersion Tin | 0.8-1.2um |
Fabrication Data Inputs
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