DTS-3, DTSM(L)-3 SERIES
Through Hole & SMT type

SPECIFICATION

Mechanical

• Operation Force: 520 ± 130gf Yellow (Y)           320 ± 80gf Salmon (S)           260 ± 50gf Red (R)           160 ± 50gf Brown (N)
• Stroke: 0.25 + 0.2mm.
                      -0.1mm
• Operation Temperature Range: -25 °C to 70 °C
• Storage Temperature Range: -30 °C to 80 °C
• Vibration Test: MIL-STD-202F METHOD 201A.
  Frequency: 10-55-10Hz/1 min.
  Directions: X, Y, Z, three mutually perpendicular directions.
  Time: 2 hours each direction.
  High reliability.
• Shock Test: MIL-STD-202F METHOD 213 B.
  CONDITION A.
  Gravity: 50G (peak value), 11 msec.
  Direction and times: 6 sides and 3 times in each direction.
  High reliability.

Electrical

• Electrical Life: 50,000 cycles for 160gf, 320gf.
            30,000 cycles for 260gf, 520gf.
• Rating: 50 mA, 12VDC.
• Contact Resistance: 100 mΩ max.
• Insulation Resistance: 100 MΩ min. 500VDC.
• Dielectric Strength: 250VAC/1 minute.
• Contact Arrangement: 1 pole 1 throw.

SOLDERING PROCESSES

• Hand soldering: Use a soldering iron of 30 watts, controlled at 350 °C approximately 5 seconds while applying solder.
• ReflowSoldering: When applying reflow soldering, the peak temperature or the reflow oven should be set to 260 °C max.
• Wave Soldering: Recommended solder temperature at 260 °C max. 5 seconds for through hole type subject to P.C.B. 1.6mm thickness.

Temperature Profile:

HOW TO ORDER

CIRCUIT

P.C.B. LAYOUT

PACKAGING